Machine Characteristics
- It belongs to a cold light source, and the thermal impact is particularly small during laser cutting or marking, and it is more suitable for deep processing of materials that are sensitive to thermal impact.
- With narrower pulse width and higher peak power, materials with higher damage thresholds such as ceramic sapphire can easily break through their damage thresholds, so it is easy to process polymer materials that require high damage thresholds;
- The minimum spot after focusing can reach 15UM, so it is very suitable for micro-hole drilling processing;
- Ultra-high peak power and minimal thermal effect characteristics, very suitable for drilling and cutting alumina and zirconia ceramics;
- Free maintenance, no consumables, low cost of use, power saving and energy saving;
- One-piece modular design, convenient maintenance and small size;
- The software can receive DXF, PLT, BMF, AI, JPG and other formats, and can automatically generate serial numbers and production dates, barcodes, and QR codes;
- Customized assembly lines can be installed.
Technical Parameters
| Engraving depth | ≤1.2mm |
| Engraving line speed | ≤12000mm/s |
| Minimum line width | 0.01mm |
| Minimum character | 0.2mm |
| Repeatability | ±0.001mm |
| Power consumption of the whole machine | ≤1000W |
| electricity demand | 220V/50Hz/10A |
| cooling method | 水冷 |
Applicable Industries
Consumer electronics, mobile phone components, LCD screen engraving QR codes and trademarks, ceramics, sapphire sheets, FPC flexible circuit board micro-hole drilling, cutting biomedical glass markings, capacitive touch screen ITO etching, etc.
Applicable Materials
Metal and various non-metal materials, ceramics, sapphire sheets, glass, transparent polymer materials, plastics, etc.
Scope of application
Mainly used for fine cutting, scribing, marking and micro-processing of various materials; laser rapid prototyping; FPC board cutting; micro-hole drilling (aperture d≤10μm); flexible PCB board marking and dicing; metal or non-metal coating Remove Silicon wafer microvia; and blind hole processing and other fields.
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